Causes the non-lead to weld into reality · the solder paste, the wave soldering liquid body solder, in the solder gelatin and the soldering tin line uses the non-lead solder already became the reality today. These solder disposition system may strengthen the welding process, its formula may provide the splendid melt wet performance, and causes chemistry

    thermostability enhancement which the non-lead assembly needs.
· the traditional welding flux which uses together with the tin lead alloys regarding prevents the non-lead alloys to melt the wet speed slow as well as with the high temperature which follows without the lead solder comes not necessarily is usually suitable. Uses in the non-lead welding the solder disposition system needing specially to use the new activator suite as well as to have the thermostble gelatin and the melt wet preparation, in order to avoid has the solder flaw. because
· many non-lead alloys melt the wet speed to be slow and to have the high surface tension, the choice suits the non-lead welding the correct solder to be possible to prevent the solder flaw increase, and can maintain the production delivers the very big help. the general flaw which possibly
· under to because of will transfer uses when non-lead assembly increases to carry on the detailed explanation. Through the choice correct solder and the craft control, these flaws may eliminate. the
■ latent flaw grows - the non-lead surface mounting to assemble · the bridge joint - solder paste hot collapse performance is bad · the soldering tin ball - solder paste collapse characteristic is bad · on the tombstone effect - line board exists hot difference · does not melt wet - excessively preheating or the welding flux activeness is insufficient · melts the wet performance difference - solder activeness bad or excessively preheating · the soldering tin hole - thermal characteristics curve is excessively low, or the solder chemistry attribute is insufficient · the soldering tin ties the bead - solder paste hot collapse performance difference or excessively preheating · the latent flaw grows - the non-lead wave to weld · bridge joint - preheating or when soldering tin contact solder deactivation · the condensation hangs the column - solder activeness to be excessively low or the preheating hyperpyrexia · the soldering tin ball - preheating insufficient or the solder - solder mask is not accommodating · the hole fills - solder activeness excessively to be not completely low, the solid state content is excessively low, perhaps the preheating hyperpyrexia or and the fusing solder contact duration is excessively short
■ to non-lead solder request: · low activation temperature · enough guarantees the nature time · high-activity rank · redundant reliability · the residuum assumes the benignity, or, if the solder paste is may the laundering, may easy eliminate
■ non-lead solder other matters needing attention: · the solder paste is uses in a rubber using in printing · please note the manufacturer regarding the different alloy use different type activator · should choose the solder carefully, makes balanced in the activation temperature and during the thermal characteristics curve · the solder with the alloy compatibility which selects is what kind of · reliable attribute (sir, electromigration, corrosion)